The Role of Rigid PCBs in Modern Electronics

Rigid printed circuit board (Rigid PCB) is widely used in electronic equipment, its main advantages are as follows:

1. Stability: The main advantage of rigid PCB is its structural stability. Compared to flexible printed circuit boards, rigid PCBS are physically more stable and not easily bent or twisted.

2. Large capacity: Another advantage of rigid PCBS is that they can accommodate more components and connections, supporting larger components and more complex circuit designs.

3. Durability: Rigid PCB has good durability and can maintain its performance under various environmental conditions, including high temperature, high humidity and high pressure.

4. Cost effectiveness: The manufacturing cost of rigid PCB may be higher than that of flexible PCB, but due to its stability and large capacity, rigid PCB can provide higher cost performance.

The advantages of Rigid PCB make it play a vital role in modern electronic equipment. Whether it is stability, large capacity, durability or cost effectiveness, rigid PCBS can meet the needs of a variety of applications.

In the manufacturing process of Rigid PCB, surface treatment is a key step. Organic Solderability Preservative (OSP) is a common surface treatment technique. OSP surface treatment involves coating the PCB surface with a thin layer of organotin protective film. This treatment method provides good welding performance, but also provides a certain amount of environmental protection. The advantages of OSP surface treatment include good weldability, lower cost and environmental protection. Due to the presence of organotin protective film, OSP-treated PCBS can provide stable welding performance, so that components can be reliably welded to the PCB. In addition, the cost of OSP treatment is relatively low, which can reduce the total cost of PCBS. The materials used in the OSP treatment are environmentally friendly and meet the green manufacturing requirements of modern electronic devices.

Insulating materials play a vital role in Rigid PCBS, not only providing physical support for circuit components, but also preventing the unintended flow of current. The insulating material of rigid PCBS is usually made of materials such as fiberglass board (FR4) or paper-based phenolic resin board (FR2), which have good insulation properties and thermal stability and can maintain their performance under various environmental conditions. The choice of insulation material has a direct impact on the performance of rigid PCB, with excellent mechanical strength and thermal stability, suitable for applications requiring high frequency and high temperature environments. Paper-based phenolic resin boards have lower cost and good insulation properties, and are suitable for low cost and low power applications.

Electroless Nickel/Immersion Gold (ENIG) is a common surface treatment technique used in the manufacture of Rigid PCB. ENIG surface treatment involves electroplating a layer of nickel on the PCB surface and then plating a thin layer of gold. The nickel layer is mainly used to protect the PCB surface and prevent oxidation, while the gold layer provides good conductivity and weldability. The advantages of ENIG surface treatment include good weldability, long-term storage stability, and environmental resistance. Due to the presence of the gold layer, the ENIG treated PCB can provide stable welding performance, so that the components can be reliably welded to the PCB. The gold layer can also prevent the oxidation of the PCB during storage and improve the storage stability of the PCB. Finally, since both gold and nickel have good corrosion resistance, ENIG treated PCBS can maintain their performance under various environmental conditions.