Cost-effective solutions with HDI PCB technology

Cost-effective solutions with HDI PCB technology

High density Interconnect HDI PCBS are characterized by high density properties, including fine lines and space, smaller through-hole and capture pads, and higher connection pad density. This technology allows more components to be installed in a small area, thus increasing the functionality of the device without increasing the size of the device. The through-hole is smaller than the traditional through-hole, allowing for more interconnection in a smaller space. Reducing signal loss and cross delay SprintPCB's expertise in HDI PCB technology sets them apart in the industry. Their commitment to quality and innovation is evident in every HDI PCB they produce.
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superior performance - price ratio

We focus on providing customers with competitive cost-effective products.

remarkable quality control

We follow the quality management system to ensure that each PCB product meets the IPC standards.

Strong production capacity

We have modern production plants and advanced equipment, with efficient production capacity.

Customer-oriented service

We put our customers first and are committed to providing an exceptional customer service experience.

Reliable delivery capabilities

We value on-time delivery and fulfilling orders in an efficient and reliable manner.

Sustainability Commitment

We take responsibility for sustainability and are committed to reducing our impact on the environment.

We Have The Best Solutions for Your Business

SprintPCB provides one-stop and competitive PCB and PCBA manufacturing services to clients worldwide.

We can provide competitive prices and guarantee the quality requirements of customers without excess quality. Our technical level can meet most of the industrial control and consumer products.

SprintPCB promises product safety with IATF16949, ISO 9001, ISO 14001 ,and UL certifications.

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RF-RF Double-sided HDI PCB applications

Rf-rf Double-sided PCB is a double-sided circuit board composed of two radio frequency (RF) layers, which has higher circuit density, while also having good electromagnetic shielding performance to meet the needs of modern electronic equipment, miniaturization, high performance and high reliability. Advanced RF-RF two-sided design and manufacturing technology precisely combines two RF layers to form a robust and superior two-sided circuit board, enabling greater integration and a more compact circuit layout.

HDI PCB built-in laminating technology

HDI PCB internal lamination is a technology that combines multiple board layers by pressure and heat, allowing for higher integration and more complex circuit designs. SprintPCB's HDI PCBS feature advanced built-in lamination technology that precisely combines multiple board layers to form a single unit, allowing for greater integration and a more compact circuit layout. Special materials and processes are used to ensure the reliability and durability of the internal lamination. These advantages make SprintPCB's HDI PCBS useful in a variety of high performance and high reliability applications.

Hybrid laminated multilayer HDI PCB applications

Hybrid laminated multilayer PCB materials and technologies are combined into a multilayer circuit board. It can achieve higher circuit density, with good electrical performance and mechanical stability, and meet the needs of modern electronic equipment for miniaturization, high performance and high reliability. Advanced hybrid lamination technology can combine different materials and technologies to form a multi-layer circuit board with superior performance. Achieve higher integration and a more compact circuit layout.

HDI PCB The advantages of multi-layer PCBS

The application of multi-layer PCBS in modern electronic devices is more and more extensive, and the HDI PCB of the SprintPCB brand is particularly excellent in this regard. Multilayer PCB A circuit board consisting of multiple board layers that are combined together by special bonding pressure treatment. Higher circuit density can be achieved to meet the needs of modern electronic equipment for miniaturization and high performance. Using advanced multi-layer design and manufacturing techniques, multiple board layers can be precisely combined to form a compact whole. This allows SprintPCB's HDI PCBS to achieve higher integration and more compact circuit layouts.

Frequently Asked Question

Do you have any question?

The lead time varies depending on the complexity of the board design and the quantity ordered.

We use high-quality materials like FR4, Polyimide, Rogers, etc., depending on the application requirements.

We can achieve via sizes as small as 0.1mm or 4 mils.

Yes, we can provide impedance control according to your specifications.

Yes, we have a team of experienced engineers who can assist with design and layout.

We conduct rigorous quality checks at every stage of the manufacturing process.

Our updates and blog posts

SprintPCB's high Density Interconnect PCB(HDI PCB) and PCBA assembly

SprintPCB provides HDI PCB and PCBA assembly services using automated equipment and strict quality control to ensure high quality, efficient and reliable products.

SprintPCB: Leading the future of Circuit boards

printPCB is a company with expertise in the field of circuit board design and manufacturing, committed to providing high quality, efficient and innovative solutions. Provide customized services to design and manufacture circuit boards according to the specific needs of customers. SprintPCB is an excellent choice.

SprintPCB leads the one-stop electronic manufacturing service, detonating the industry boom!

SprintPCB led the way in one-stop electronic manufacturing services at electronica China (Munich Shanghai Electronics Show) in 2023, setting off an industry boom.

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