We focus on providing customers with competitive cost-effective products.
We follow the quality management system to ensure that each PCB product meets the IPC standards.
We have modern production plants and advanced equipment, with efficient production capacity.
We put our customers first and are committed to providing an exceptional customer service experience.
We value on-time delivery and fulfilling orders in an efficient and reliable manner.
We take responsibility for sustainability and are committed to reducing our impact on the environment.
SprintPCB provides one-stop and competitive PCB and PCBA manufacturing services to clients worldwide.
We can provide competitive prices and guarantee the quality requirements of customers without excess quality. Our technical level can meet most of the industrial control and consumer products.
SprintPCB promises product safety with IATF16949, ISO 9001, ISO 14001 ,and UL certifications.
The manufacturing process of multilayer PCBS is a complex and precise process involving several steps,
Design and layout, material selection, inner fabrication, lamination and bonding, drilling, outer production, testing and inspection, welding and screen printing, testing and inspection, final assembly and packaging; The production process of multilayer PCBS involves several complex steps that require expertise and precision. SprintPCB's commitment to excellence at every stage of the manufacturing process has made them a leading brand in the industry. Their advanced technology, material selection and rigorous test procedures result in high quality multi-layer PCBS to meet the diverse needs of customers.
A multilayer pcb consists of multiple layers of conductive material separated by a dielectric layer. The number of layers in a multilayer PCB can vary depending on the complexity of the circuit design and the desired functionality. Provide multi-layer pcb, the number of layers from 2 to more than 50 layers, to meet the different needs of customers. The number of layers of a multilayer PCB is a key factor affecting performance, reliability and cost. Higher layers allow for higher component densities and more complex circuits, enabling the integration of advanced features and functions. More layers also mean increased manufacturing complexity and cost, so it's important to strike a balance between functionality and feasibility.
Drilling is a step in multilayer pcb production that involves creating holes in the PCB that serve as conduits for electrical connections between layers to provide high-quality and reliable multilayer PCBS. The drilling process requires a high degree of precision, ensuring the exact position of the hole and the correct size. Any mistake during drilling can lead to problems such as misalignment of the formation or poor electrical connections. In addition to standard drilling, techniques such as laser drilling can be utilized to create microholes. After drilling, these holes are plated with conductive material to create an electrical connection between the layers. The precision drilling method used by SprintPCB has played an important role in its production of high-quality multi-layer PCBS.
The lamination and bonding process is the key to the manufacture of multilayer pcb. During the lamination process, the various layers of the PCB are stacked on top of each other. Each layer consists of conductive and dielectric materials and is aligned with the other layers. The pile is then heated and pressurized in a tablet press. Heat and pressure cause the thermosetting resin in the prepreg (dielectric material) to flow, fill the voids, and then cure. This creates a strong, stable bond between the two layers. The bonding process ensures that each layer of the PCB is securely connected to the other layers. It is critical to the overall performance and reliability of multilayer PCBS. SprintPCB's commitment to quality control means that each multi-layer PCB is rigorously tested after lamination and bonding. This ensures that any potential problems can be identified and corrected early in the manufacturing process.
<p>We use high-quality FR-4 glass epoxy as the primary insulating substrate.</p>
<p>We can manufacture PCBs with up to 40 layers</p>
<p>Yes, all our PCBs are RoHS compliant.</p>
<p>Our standard payment terms are T/T in advance, but we can negotiate based on your needs.</p>
<p>Yes, we provide technical support and a warranty period for our products.</p>
<p>Yes, we have experience working with a variety of high-frequency materials.</p>
<p>Yes, we can support both blind and buried vias.</p>
<p>We accept Gerber files, but also other formats like Eagle, Altium, and KiCad.</p>