We focus on providing customers with competitive cost-effective products.
We follow the quality management system to ensure that each PCB product meets the IPC standards.
We have modern production plants and advanced equipment, with efficient production capacity.
We put our customers first and are committed to providing an exceptional customer service experience.
We value on-time delivery and fulfilling orders in an efficient and reliable manner.
We take responsibility for sustainability and are committed to reducing our impact on the environment.
SprintPCB provides one-stop and competitive PCB and PCBA manufacturing services to clients worldwide.
We can provide competitive prices and guarantee the quality requirements of customers without excess quality. Our technical level can meet most of the industrial control and consumer products.
SprintPCB promises product safety with IATF16949, ISO 9001, ISO 14001 ,and UL certifications.
In the manufacturing process of Rigid PCB, surface treatment is a key step. Organic Solderability Preservative (OSP) is a common surface treatment technique. OSP surface treatment involves coating the PCB surface with a thin layer of organotin protective film. This treatment method provides good welding performance, but also provides a certain amount of environmental protection. The advantages of OSP surface treatment include good weldability, lower cost and environmental protection. Due to the presence of organotin protective film, OSP-treated PCBS can provide stable welding performance, so that components can be reliably welded to the PCB. In addition, the cost of OSP treatment is relatively low, which can reduce the total cost of PCBS. The materials used in the OSP treatment are environmentally friendly and meet the green manufacturing requirements of modern electronic devices.
Some of the main steps of the rigid PCB manufacturing process:
Design: Use computer aided design (CAD) software to design circuit diagrams. The function, size, layout and other factors of the circuit to create an effective and workable design.
Plate making: After the design is complete, the design needs to be converted into the actual circuit board. Through lithography technology, ultraviolet light is irradiated on a copper plate covered with a photosensitive material, and then the part that is not irradiated by ultraviolet light is etched through an acidic solution to form a circuit pattern.
Drilling: Drilling holes in the circuit board to install electronic components. This is done using a CNC drilling machine, which allows drilling to be done precisely at the specified location.
Coating: After drilling, a thin layer of copper needs to be plated on the wall of the hole to ensure the conductivity in the hole, which is achieved by electrochemical deposition.
Patch: Mount electronic components to a circuit board. This is done with an automatic mounter, which can quickly and accurately attach components to the specified position.
Welding: The components are welded together with the circuit board to ensure electrical connections. Use wave soldering or reflow welding method to achieve.
Each step requires precise control and rigorous quality checks to ensure the performance and reliability of the final product.
Insulating materials play a vital role in Rigid PCBS, not only providing physical support for circuit components, but also preventing the unintended flow of current. The insulating material of rigid PCBS is usually made of materials such as fiberglass board (FR4) or paper-based phenolic resin board (FR2), which have good insulation properties and thermal stability and can maintain their performance under various environmental conditions. The choice of insulation material has a direct impact on the performance of rigid PCB, with excellent mechanical strength and thermal stability, suitable for applications requiring high frequency and high temperature environments. Paper-based phenolic resin boards have lower cost and good insulation properties, and are suitable for low cost and low power applications.
Electroless Nickel/Immersion Gold (ENIG) is a common surface treatment technique used in the manufacture of Rigid PCB. ENIG surface treatment involves electroplating a layer of nickel on the PCB surface and then plating a thin layer of gold. The nickel layer is mainly used to protect the PCB surface and prevent oxidation, while the gold layer provides good conductivity and weldability. The advantages of ENIG surface treatment include good weldability, long-term storage stability, and environmental resistance. Due to the presence of the gold layer, the ENIG treated PCB can provide stable welding performance, so that the components can be reliably welded to the PCB. The gold layer can also prevent the oxidation of the PCB during storage and improve the storage stability of the PCB. Finally, since both gold and nickel have good corrosion resistance, ENIG treated PCBS can maintain their performance under various environmental conditions.
<p>We manufacture single-sided, double-sided, and multi-layer rigid PCBs.</p>
<p>Our PCBs are typically made from FR4, a glass-reinforced epoxy laminate material.</p>
<p>We offer several finishes, including HASL, ENIG, Immersion Silver, and OSP.</p>
<p>Our standard lead time is 2 weeks, but expedited services are available.</p>
<p>Yes, we have an experienced design team that can assist with your PCB design needs.</p>
<p>We adhere to IPC standards and conduct rigorous inspections and testing to ensure quality.</p>
<p>Yes, we offer after-sales support and are committed to resolving any issues that may arise.</p>
<p>We package our PCBs in ESD-safe packaging to prevent damage during transit.</p>
<p>We can accommodate orders of all sizes, from prototypes to large-scale production runs.</p>