We focus on providing customers with competitive cost-effective products.
We follow the quality management system to ensure that each PCB product meets the IPC standards.
We have modern production plants and advanced equipment, with efficient production capacity.
We put our customers first and are committed to providing an exceptional customer service experience.
We value on-time delivery and fulfilling orders in an efficient and reliable manner.
We take responsibility for sustainability and are committed to reducing our impact on the environment.
SprintPCB provides one-stop and competitive PCB and PCBA manufacturing services to clients worldwide.
We can provide competitive prices and guarantee the quality requirements of customers without excess quality. Our technical level can meet most of the industrial control and consumer products.
SprintPCB promises product safety with IATF16949, ISO 9001, ISO 14001 ,and UL certifications.
The outer layer of a multi-layer PCB is where most components are placed and welded, ensuring proper component placement and welding. A series of steps are involved, including layer imaging, etching and solder resistance applications. Layer imaging involves transferring the circuit design to the outer layer, where the film hardens when exposed to light and the hardened area is etched to preserve the electrical path.
Etching is the process of removing unwanted copper from the outer layer to show the circuit path. A solder mask is applied during component placement to protect the circuit and prevent solder bridging. Excellent insulation and protection with a high quality solder mask.
Drilling is a step in multilayer pcb production that involves creating holes in the PCB that serve as conduits for electrical connections between layers to provide high-quality and reliable multilayer PCBS. The drilling process requires a high degree of precision, ensuring the exact position of the hole and the correct size. Any mistake during drilling can lead to problems such as misalignment of the formation or poor electrical connections. In addition to standard drilling, techniques such as laser drilling can be utilized to create microholes. After drilling, these holes are plated with conductive material to create an electrical connection between the layers. The precision drilling method used by SprintPCB has played an important role in its production of high-quality multi-layer PCBS.
Designing multi-layer PCBS requires sophisticated software tools to streamline the process and ensure effective collaboration between designers and manufacturers.
PCB layout and design:
Provides a user-friendly interface for creating multi-layer PCB layouts, ensuring compliance with manufacturing guidelines.
Layer Stack management:
The designer defines and visualizes the layer stacking configuration, including the number and order of layers, the thickness of the copper, and the dielectric material. Helps ensure proper signal integrity, power distribution, and thermal management in PCB design.
Signal integrity analysis:
By simulating impedance, crosstalk, and other electrical characteristics, designers can optimize routing and minimize noise, ensuring reliable signal transmission between layers.
Thermal Analysis and Management:
Thermal analysis is performed by simulating heat dissipation, identifying hot spots, and optimizing copper pouring and hot through holes. Heat dissipation is ensured, avoiding overheating problems that could reduce component performance or shorten its service life.
Design rule verification:
Manufacturing constraints and guidelines, such as minimum line widths, spacing requirements, and drill hole sizes. The software automatically checks the design against these rules, reducing the chance of manufacturing problems and ensuring manufacturability.
Collaboration and document exchange:
Support seamless file exchange, sharing design files in a variety of formats for review and production. Simplified communication facilitates a smooth transition from design to manufacturing, minimising errors and ensuring accuracy.
Manufacturing Design (DFM) analysis:
Ensuring the manufacturability of multilayer PCB designs is critical. Such as copper bars, acid traps, or excessive thinning of the trace during manufacturing.
In summary, SprintPCB's application software simplifies the design process of multi-layer PCBS, providing designers with powerful tools for layout creation, layer stack management, signal integrity analysis, thermal management, and design rule verification.
A multilayer pcb consists of multiple layers of conductive material separated by a dielectric layer. The number of layers in a multilayer PCB can vary depending on the complexity of the circuit design and the desired functionality. Provide multi-layer pcb, the number of layers from 2 to more than 50 layers, to meet the different needs of customers. The number of layers of a multilayer PCB is a key factor affecting performance, reliability and cost. Higher layers allow for higher component densities and more complex circuits, enabling the integration of advanced features and functions. More layers also mean increased manufacturing complexity and cost, so it's important to strike a balance between functionality and feasibility.
<p>We use high-quality FR-4 glass epoxy as the primary insulating substrate.</p>
<p>We can manufacture PCBs with up to 40 layers</p>
<p>Yes, all our PCBs are RoHS compliant.</p>
<p>Our standard payment terms are T/T in advance, but we can negotiate based on your needs.</p>
<p>Yes, we provide technical support and a warranty period for our products.</p>
<p>Yes, we have experience working with a variety of high-frequency materials.</p>
<p>Yes, we can support both blind and buried vias.</p>
<p>We accept Gerber files, but also other formats like Eagle, Altium, and KiCad.</p>