We focus on providing customers with competitive cost-effective products.
We follow the quality management system to ensure that each PCB product meets the IPC standards.
We have modern production plants and advanced equipment, with efficient production capacity.
We put our customers first and are committed to providing an exceptional customer service experience.
We value on-time delivery and fulfilling orders in an efficient and reliable manner.
We take responsibility for sustainability and are committed to reducing our impact on the environment.
SprintPCB provides one-stop and competitive PCB and PCBA manufacturing services to clients worldwide.
We can provide competitive prices and guarantee the quality requirements of customers without excess quality. Our technical level can meet most of the industrial control and consumer products.
SprintPCB promises product safety with IATF16949, ISO 9001, ISO 14001 ,and UL certifications.
The lamination and bonding process is the key to the manufacture of multilayer pcb. During the lamination process, the various layers of the PCB are stacked on top of each other. Each layer consists of conductive and dielectric materials and is aligned with the other layers. The pile is then heated and pressurized in a tablet press. Heat and pressure cause the thermosetting resin in the prepreg (dielectric material) to flow, fill the voids, and then cure. This creates a strong, stable bond between the two layers. The bonding process ensures that each layer of the PCB is securely connected to the other layers. It is critical to the overall performance and reliability of multilayer PCBS. SprintPCB's commitment to quality control means that each multi-layer PCB is rigorously tested after lamination and bonding. This ensures that any potential problems can be identified and corrected early in the manufacturing process.
Designing multi-layer PCBS requires sophisticated software tools to streamline the process and ensure effective collaboration between designers and manufacturers.
PCB layout and design:
Provides a user-friendly interface for creating multi-layer PCB layouts, ensuring compliance with manufacturing guidelines.
Layer Stack management:
The designer defines and visualizes the layer stacking configuration, including the number and order of layers, the thickness of the copper, and the dielectric material. Helps ensure proper signal integrity, power distribution, and thermal management in PCB design.
Signal integrity analysis:
By simulating impedance, crosstalk, and other electrical characteristics, designers can optimize routing and minimize noise, ensuring reliable signal transmission between layers.
Thermal Analysis and Management:
Thermal analysis is performed by simulating heat dissipation, identifying hot spots, and optimizing copper pouring and hot through holes. Heat dissipation is ensured, avoiding overheating problems that could reduce component performance or shorten its service life.
Design rule verification:
Manufacturing constraints and guidelines, such as minimum line widths, spacing requirements, and drill hole sizes. The software automatically checks the design against these rules, reducing the chance of manufacturing problems and ensuring manufacturability.
Collaboration and document exchange:
Support seamless file exchange, sharing design files in a variety of formats for review and production. Simplified communication facilitates a smooth transition from design to manufacturing, minimising errors and ensuring accuracy.
Manufacturing Design (DFM) analysis:
Ensuring the manufacturability of multilayer PCB designs is critical. Such as copper bars, acid traps, or excessive thinning of the trace during manufacturing.
In summary, SprintPCB's application software simplifies the design process of multi-layer PCBS, providing designers with powerful tools for layout creation, layer stack management, signal integrity analysis, thermal management, and design rule verification.
The composition of the material plays an important role in determining the performance, reliability and cost of multilayer PCBS. The conductive material used in multilayer PCBS is typically copper and varies in thickness from 0.5 to 2 ounces per square foot. Dielectric materials are used to separate conducting layers and prevent electrical interference, and copper's high conductivity and corrosion resistance become the choice for multilayer PCBS, including FR-4, Rogers, and polyimide, optimized for different applications and environments. SprintPCB uses high-quality materials sourced from reliable suppliers to ensure that its products meet the industry's stringent quality standards.
The manufacturing process of multilayer PCBS is a complex and precise process involving several steps,
Design and layout, material selection, inner fabrication, lamination and bonding, drilling, outer production, testing and inspection, welding and screen printing, testing and inspection, final assembly and packaging; The production process of multilayer PCBS involves several complex steps that require expertise and precision. SprintPCB's commitment to excellence at every stage of the manufacturing process has made them a leading brand in the industry. Their advanced technology, material selection and rigorous test procedures result in high quality multi-layer PCBS to meet the diverse needs of customers.
<p>We use high-quality FR-4 glass epoxy as the primary insulating substrate.</p>
<p>We can manufacture PCBs with up to 40 layers</p>
<p>Yes, all our PCBs are RoHS compliant.</p>
<p>Our standard payment terms are T/T in advance, but we can negotiate based on your needs.</p>
<p>Yes, we provide technical support and a warranty period for our products.</p>
<p>Yes, we have experience working with a variety of high-frequency materials.</p>
<p>Yes, we can support both blind and buried vias.</p>
<p>We accept Gerber files, but also other formats like Eagle, Altium, and KiCad.</p>