We focus on providing customers with competitive cost-effective products.
We follow the quality management system to ensure that each PCB product meets the IPC standards.
We have modern production plants and advanced equipment, with efficient production capacity.
We put our customers first and are committed to providing an exceptional customer service experience.
We value on-time delivery and fulfilling orders in an efficient and reliable manner.
We take responsibility for sustainability and are committed to reducing our impact on the environment.
SprintPCB provides one-stop and competitive PCB and PCBA manufacturing services to clients worldwide.
We can provide competitive prices and guarantee the quality requirements of customers without excess quality. Our technical level can meet most of the industrial control and consumer products.
SprintPCB promises product safety with IATF16949, ISO 9001, ISO 14001 ,and UL certifications.
HDI PCB internal lamination is a technology that combines multiple board layers by pressure and heat, allowing for higher integration and more complex circuit designs. SprintPCB's HDI PCBS feature advanced built-in lamination technology that precisely combines multiple board layers to form a single unit, allowing for greater integration and a more compact circuit layout. Special materials and processes are used to ensure the reliability and durability of the internal lamination. These advantages make SprintPCB's HDI PCBS useful in a variety of high performance and high reliability applications.
Rf-rf Double-sided PCB is a double-sided circuit board composed of two radio frequency (RF) layers, which has higher circuit density, while also having good electromagnetic shielding performance to meet the needs of modern electronic equipment, miniaturization, high performance and high reliability. Advanced RF-RF two-sided design and manufacturing technology precisely combines two RF layers to form a robust and superior two-sided circuit board, enabling greater integration and a more compact circuit layout.
Hybrid laminated multilayer PCB materials and technologies are combined into a multilayer circuit board. It can achieve higher circuit density, with good electrical performance and mechanical stability, and meet the needs of modern electronic equipment for miniaturization, high performance and high reliability. Advanced hybrid lamination technology can combine different materials and technologies to form a multi-layer circuit board with superior performance. Achieve higher integration and a more compact circuit layout.
The application of multi-layer PCBS in modern electronic devices is more and more extensive, and the HDI PCB of the SprintPCB brand is particularly excellent in this regard. Multilayer PCB A circuit board consisting of multiple board layers that are combined together by special bonding pressure treatment. Higher circuit density can be achieved to meet the needs of modern electronic equipment for miniaturization and high performance. Using advanced multi-layer design and manufacturing techniques, multiple board layers can be precisely combined to form a compact whole. This allows SprintPCB's HDI PCBS to achieve higher integration and more compact circuit layouts.
<p>The lead time varies depending on the complexity of the board design and the quantity ordered.</p>
<p>We use high-quality materials like FR4, Polyimide, Rogers, etc., depending on the application requirements.</p>
<p>We can achieve via sizes as small as 0.1mm or 4 mils.</p>
<p>Yes, we can provide impedance control according to your specifications.</p>
<p>Yes, we have a team of experienced engineers who can assist with design and layout.</p>
<p>We conduct rigorous quality checks at every stage of the manufacturing process.</p>