The Manufacturing Process of Rigid PCBs

In the manufacturing process of Rigid PCB, surface treatment is a key step. Organic Solderability Preservative (OSP) is a common surface treatment technique. OSP surface treatment involves coating the PCB surface with a thin layer of organotin protective film. This treatment method provides good welding performance, but also provides a certain amount of environmental protection. The advantages of OSP surface treatment include good weldability, lower cost and environmental protection. Due to the presence of organotin protective film, OSP-treated PCBS can provide stable welding performance, so that components can be reliably welded to the PCB. In addition, the cost of OSP treatment is relatively low, which can reduce the total cost of PCBS. The materials used in the OSP treatment are environmentally friendly and meet the green manufacturing requirements of modern electronic devices.

Immersion Silver is a common surface treatment technique used in the manufacture of Rigid PCB. Silver immersion surface treatment involves depositing a thin layer of silver on the PCB surface to provide good conductivity and weldability, environmental protection. The advantages of silver impregnated surface treatment are good weldability, low resistance and good electrical properties. Due to the presence of the silver layer, the silver impregnated PCB can provide stable welding performance, so that the components can be reliably welded to the PCB. The silver layer can also provide lower resistance, thereby improving the performance of the circuit.

Insulating materials play a vital role in Rigid PCBS, not only providing physical support for circuit components, but also preventing the unintended flow of current. The insulating material of rigid PCBS is usually made of materials such as fiberglass board (FR4) or paper-based phenolic resin board (FR2), which have good insulation properties and thermal stability and can maintain their performance under various environmental conditions. The choice of insulation material has a direct impact on the performance of rigid PCB, with excellent mechanical strength and thermal stability, suitable for applications requiring high frequency and high temperature environments. Paper-based phenolic resin boards have lower cost and good insulation properties, and are suitable for low cost and low power applications.

Electroless Nickel/Immersion Gold (ENIG) is a common surface treatment technique used in the manufacture of Rigid PCB. ENIG surface treatment involves electroplating a layer of nickel on the PCB surface and then plating a thin layer of gold. The nickel layer is mainly used to protect the PCB surface and prevent oxidation, while the gold layer provides good conductivity and weldability. The advantages of ENIG surface treatment include good weldability, long-term storage stability, and environmental resistance. Due to the presence of the gold layer, the ENIG treated PCB can provide stable welding performance, so that the components can be reliably welded to the PCB. The gold layer can also prevent the oxidation of the PCB during storage and improve the storage stability of the PCB. Finally, since both gold and nickel have good corrosion resistance, ENIG treated PCBS can maintain their performance under various environmental conditions.